Sang-Kon Kim: Publications All

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  1. “Impact of plasmonic parameters on 7-nm Patterning in plasmonic computational lithography, “ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 18 7120-7327 (2018), Impact Factor = 1.483. [abstract]

  2. “A Molecular View of Block Copolymer Directed Assembly with Solvent Vapors Simulation, “ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 17 8369-8371 (2017), Impact Factor = 1.483. [abstract]

  3. “Effects of Line-Edge Roughness on Extreme Ultraviolet Lithography CDs and Fin-Field-Effect-Transistor Performance for Below 10-nm Patterns,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 17 8338-8343 (2017), Impact Factor = 1.483. [abstract]

  4. “Impact of Process Parameters on a Combining Process of Block-Copolymer Self-Assembly with Electrohydrodynamic Jet Printing,“ Sang-Kon Kim, Sci. Adv. Mater. 91, 42-47 (January 2017). Impact Factor = 1.812 [abstract]

  5. “Computational Study of Electrohydrodynamic Jet Printing with Block-Copolymer Inks,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 17 5432-5435 (2017), Impact Factor = 1.483 [abstract]

  6. “Effect of Computational Lithography Parameters on the Organic Light-Emitting Diodes,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 16, 8, 8496-8499 (2016), Impact Factor = 1.556 [abstract]

  7. “Extreme Ultraviolet Multilayer Defect Compensation in Computational Lithography,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 16, 5, 5410-5419 (2016), Impact Factor = 1.556 [abstract]

  8. “Prediction of electric field effects on defect-free self-assembled nano-patterning of block copolymer ,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 16, 3, 2706-2709 (2016), Impact Factor = 1.556 [abstract]

  9. “Impact of process parameters on pattern formation in the maskless plasmonic computational lithography,“ Sang-Kon Kim, Current Applied Physics (CAP), 15, 6, 698-702 June (2015), Impact Factor = 2.026 [abstract]

  10. “Contact hole shrinking of directed self-assembly and its application based on simulation approach,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 15, 10, 8183-8186 (2015), Impact Factor = 1.352 [abstract]

  11. “Computational Nanopatterning in the Plasmonic Metamaterials for Diffraction Limit,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 15, 2, 1368-1374 (2015), Impact Factor = 1.352 [abstract]

  12. “Modeling and Analysis for Contact Hole Shrink by Directed Self-Assembly,“ Sang-Kon Kim, Journal of Korean Physical Society (JKPS), 65, 10, 1701-1705, November (2014), Impact Factor = 0.476 [abstract]

  13. “Impact of Process Parameters on Pattern Formation of the Self-Aligned Multiple Patterning Process,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 14, 12, 9454-9458 Dec. (2014), Impact Factor = 1.352 [abstract]

  14. “Modeling and Simulation of Line Edge Roughness for EUV Resists,“ Sang-Kon Kim, Journal of Semiconductor Technology and Science (JSTS), 14, 1, 61-69, Feb. (2014), SCIE Impact Factor = 0.58 [pdf]

  15. “Modeling and Simulation of Patterning Diblock Copolymers Through Nanoimprint Lithography,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 14, 8, 6065-6068 Aug. (2014), Impact Factor = 1.352 [abstract]

  16. “Stochastic Simulation Studies of Line-Edge Roughness in Block Copolymer Lithography,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 14, 8, 6143-6145 Aug. (2014), Impact Factor = 1.352 [abstract]

  17. “Aerial Image Formation of Quantum Lithography for Diffraction Limit,“ Sang-Kon Kim, Current Applied Physics (CAP), 12, 8, 6, 1566-1574, Nov. (2012) Impact Factor = 1.90 [abstract]

  18. “Sensitivity of Process Parameters on Pattern Formation of Litho-Cure-Litho-Etch Process,“ Sang-Kon Kim, Japanese Journal of Applied Physics (JJAP), 51, 06FC02-1~06FC02-5, June (2012), Impact Factor = 1.018 [abstract]

  19. “Pattern Interactions of Post Exposure Bake in Litho-Cure-Litho-Etch Process,“ Sang-Kon Kim, Journal of Korean Physical Society (JKPS), 60, 10, 1776-1780, May (2012). Impact Factor = 0.476 [abstract]

  20. “Directed Self-Assembly Lithography and Its Application Based on Simulation Approach,“ Sang-Kon Kim, Journal of Nanoscience and Nanotechnology (JNN), 12, 4, 3412-3416, April (2012), Impact Factor = 1.352 [abstract]

  21. “Exposed Pattern Interaction of Litho-Cure-Litho-Etch Process in Computational Lithography,“ Sang-Kon Kim, Journal of Korean Physical Society (JKPS)), 59, 21, 425-430, August (2011), Impact Factor = 0.476 [abstract]

  22. “Advanced Lithography Simulation for Various 3-Dimensional Nano/Microstructuring Fabrications in Positive- and Negative-Tone Photoresists,“ Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An, Journal of Nanoscience and Nanotechnology (JNN), 11, 528-532 Jan. (2011), Impact Factor = 1.352 [abstract]

  23. “Simulation Study of Sub-10 nm Pattern Formation Using Diblock Polymer Directed Self-assembly,“ Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An, Journal of Korean Physical Society (JKPS), 57, 61, 1942-1945, Dec. (2010), Impact Factor = 1.204 [abstract]

  24. “Mechanism of Embedded Micro / Nano Channel Formation for a Negative-Tone Photoresist by Moving Mask Lithography,“ Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An, Journal of Korean Physical Society (JKPS), 56, 3, 851-855 (2010). Impact Factor = 1.204 [abstract]

  25. “A study of virtual lithography process for polymer directed self-assembly ,“ Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An, Microelectronic Engineering, 87, 883-886 May-Oct. (2010), Impact Factor = 1.583 [abstract]

  26. “Impact of Polarization Inside a Resist for ArF Immersion Lithography ,“ Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An, Journal of Korean Physical Society (JKPS), 54, No. 4, 1685-1691, April (2009). Impact Factor = 1.204 [abstract]

  27. “Impact of the Parameters for a Chemically-amplified Resist on the Line-edge-roughness by Using a Molecular-scale Lithography Simulation ,“ Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An, Journal of Korean Physical Society (JKPS), 55, No. 2, 675-680, August (2009). Impact Factor = 1.204 [abstract]

  28. “Modeling of the Cross-linking and the Diffusion Processes in a Negative Chemically Amplified Resist,“ Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An, Journal of Korean Physical Society (JKPS), 55, No. 2, 661-665, August (2009). Impact Factor = 1.204 [abstract]

  29. “A Mask Generation Approach to Double Patterning Technology with Inverse Lithography,“ Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An, Japanese Journal of Applied Physics (JJAP), 47, No. 11, November (2008). Impact Factor = 1.247 [abstract]

  30. “Solving the Navier-Stokes Equation for Thermal Reflow,“ Sang-Kon Kim and Hye-Keun Oh, Journal of Korean Physical Society (JKPS), 53, No. 5, 2682-2687, November (2008). Impact Factor = 1.204 [abstract]

  31. “Influence of Mask Feature on the Diffracted Light in Proximity and Contact Lithography,“ Sang-Kon Kim and Hye-Keun Oh, Journal of Korean Physical Society (JKPS), 53, No. 96, 3578-3583, December (2008). Impact Factor = 1.204 [abstract]

  32. “Thermal Treatment for Optical Proximity Correction,“ Sang-Kon Kim, Microelectronic Engineering, 84, 766-769, May-August. (2007), Impact Factor = 1.398 [abstract]

  33. “Polarized Effects in Optical Lithography with High NA Technology,“ Sang-Kon Kim, Journal of Korean Physical Society (JKPS), 50, No. 6, 1952-1958, June (2007), Impact Factor = 1.328 [abstract]

  34. “Process Extension Techniques for Optical Lithography: Thermal Treatment, Polarization and Double Patterning,“ Sang-Kon Kim, Journal of Korean Physical Society (JKPS), 51, No. 4, 1413-1418, October (2007). Impact Factor = 1.328 [abstract]

  35. “Orthogonal Functional Method for Optical Proximity Correction of Thermal Processes in Optical Lithography,“ Sang-Kon Kim, Japanese Journal of Applied Physics (JJAP), 46, No. 12, 7662-7665, December (2007), Impact Factor = 1.222 [abstract]

  36. “Thermal Effect Study for a Chemically Amplified Resist,“ Sang-Kon Kim, Journal of Korean Physical Society (JKPS), 49, No. 3, 1211-1216, Sep. (2006). Impact Factor = 1.328 [abstract]

  37. “Simulator for the Design Considered Critical Dimension Bias in Resist Reflow Process,“ Sang-Kon Kim and Tae Seon Kim, Journal of Korean Physical Society (JKPS), 48, No. 6, 1661-1665, June (2006). Impact Factor = 1.328 [abstract]

  38. “Model-Based Optical Proximity Correction for Resist Reflow Process,“ Sang-Kon Kim, Japanese Journal of Applied Physics (JJAP), 45, No. 6B, 5440-5444, June (2006). Impact Factor = 1.222 [abstract]

  39. “Resist Reflow Process Simulation Study for Contact Hole Pattern,“ Sang-Kon Kim, Journal of Vacuum Science and Technology (JVST) B, 24, 200-204, Jan./Feb. (2006), Impact Factor = 1.597 [abstract]

  40. “Optical Lithography Simulation for the Whole Resist Process,“ Sang-Kon Kim, Ji-Eun Lee, Seung-Wook Park, Hye-Keun Oh, Current Applied Physics, 6, Issue 1, 48~53, Jan. (2006). (SCIE) Impact Factor = 1.184 [abstract]

  41. “Simulator for Resist-Reflow Process by Boundary Movement,“ Sang-Kon Kim and Hye-Keun Oh, Journal of Korean Physical Society (JKPS), 47, 93, S377-S380, Nov. (2005). Impact Factor = 1.328 [abstract]

  42. “Physical Characteristic Effects of Contact Hole Reflow,“ Sang-Kon Kim, Japanese Journal of Applied Physics (JJAP), 44, No.10, 7384-7389, Oct. (2005). Impact Factor = 1.222 [abstract]

  43. “Bulk Effects of Thermal Flow Resists,“ Sang-Kon Kim, Hye-Keun Oh, Ilsin An, Sung-Muk Lee, Cheol-Kyu Bok, and Seung-Chan Moon Journal of Korean Physical Society (JKPS), 46, 6,1439~1444, June (2005), Impact Factor = 1.328 [abstract]

  44. “A Study of Process Parameter Control for Nanopattern,“ Sang-Kon Kim and Hye-Keun Oh, Journal of Korean Physical Society (JKPS), 45, 96, S736 ~ S739, Dec.(2004). Impact Factor = 1.328 [abstract]

  45. “Exposure Simulation Model for Chemically Amplified Resists,“ Sang-Kon Kim, OPTICAL REVIEW, 10, No. 4, 335-338 (July/Aug. 2003). Impact Factor = 0.576

  46. “Pattern Collapse for Nanoline Formation,“ Sang-Kon Kim, Journal of the Korean Physical Society (JKPS), 42, Feb. S371-S375 (2003). Impact Factor = 1.328 [abstract]

  47. “Resist Distribution Effect of Spin Coating,“ Sang-Kon Kim, Ji-Yong Yoo and Hye-Keun Oh, Journal of Vacuum Science and Technology (JVST) B, 20, Issue 6, 2206~2209 Nov. (2002). Impact Factor = 1.597 [abstract]

  48. “Bulk Image Formation of Scalar Modeling in Photoresist,“ Sang-Kon Kim and Hye-Keun Oh, Journal of the Korean Physical Society (JKPS), 41, No. 4, 456-460 (2002). Impact Factor = 1.328, [abstract]

  49. “Sensitivity of Simulation Parameter for Critical Dimension,“ Sang-Kon Kim and Hye-Keun Oh, Japanese Journal of Applied Physics (JJAP), 41, No. 6B, 4222-4227 (2002). Impact Factor = 1.222, [abstract]