| JOURNAL PAPERS (SCI) |
| 1. Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An,
"Advanced Lithography Simulation for Various 3-Dimensional Nano/Microstructuring
Fabrications in Positive- and Negative-Tone Photoresists," Journal of Nanoscience
and Nanotechnology (JNN), Vol.11, 528-532 Jan. (2011) Impact Factor = 1.352
[abstract]
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| 2. Sang-Kon Kim, "Exposed Pattern Interaction of
Litho-Cure-Litho-Etch Process in Computational Lithography," Journal of Korean
Physical Society (JKPS), Vol.59, 2, 425-430, August (2011).
Impact Factor = 0.476
[abstract] |
| 3. Sang-Kon Kim, "Directed Self-Assembly Lithography and
Its Application Based on Simulation Approach," Journal of Nanoscience and Nanotechnology (JNN),
Vol.12,4,3412-3416, April (2012). Impact Factor = 1.352
[abstract]
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| 4. Sang-Kon Kim, "Pattern Interactions of Post Exposure Bake in
Litho-Cure-Litho-Etch Process", Journal of Korean Physical Society (JKPS), Vol.60, 10,
1776-1780, May (2012). Impact Factor = 0.476
[abstract]
|
| 5. Sang-Kon Kim, "Sensitivity of Process Parameters on Pattern
Formation of Litho-Cure-Litho-Etch Process," Japanese Journal of Applied Physics (JJAP), Vol.51
06FC02-1~06FC02-5, June (2012) Impact Factor = 1.018
[abstract]
|
| 6. Sang-Kon Kim, "Aerial Image Formation of Quantum Lithography for
Diffraction Limit," Current Applied Physics (CAP) Vol. 12, 6, 1566-1574, Nov. (2012) Impact Factor = 1.90
[abstract]
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| 7. Sang-Kon Kim, "Stochastic Simulation Studies of Line-Edge
Roughness in Block Copolymer Lithography," Journal of Nanoscience
and Nanotechnology (JNN), Vol.14, 8, 6143-6145 Aug. (2014) Impact Factor = 1.352
[abstract]
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| 8. Sang-Kon Kim, "Modeling and Simulation of Patterning Diblock Copolymers
Through Nanoimprint Lithography," Journal of Nanoscience
and Nanotechnology (JNN), Vol.14, 8, 6065-6068 Aug. (2014) Impact Factor = 1.352
[abstract]
|
9. Sang-Kon Kim, "Modeling and Simulation of Line Edge Roughness
for EUV Resists," Journal of Semiconductor Technology and Science (JSTS) Vol. 14, 1, 61-69, Feb. (2014) SCIE Impact Factor = 0.58
|
| 10. Sang-Kon Kim, "Impact of Process Parameters on Pattern Formation of
the Self-Aligned Multiple Patterning Process," Journal of Nanoscience
and Nanotechnology (JNN), Vol.14, 12, 9454-9458 Dec. (2014) Impact Factor = 1.352
[abstract] |
| 11. Sang-Kon Kim, "Modeling and Analysis for Contact Hole Shrink
by Directed Self-Assembly," Journal of Korean Physical Society (JKPS), Vol.65, 10,
1701-1705, November (2014). Impact Factor = 0.476
[abstract]
|
| 12. Sang-Kon Kim, "Computational Nanopatterning in the Plasmonic
Metamaterials for Diffraction Limit," Journal of Nanoscience and Nanotechnology (JNN),
Vol.15, 2, 1368-1374 (2015) Impact Factor = 1.352
[abstract] |
| 13. Sang-Kon Kim, "Contact hole shrinking of directed self-assembly
and its application based on simulation approach," Journal of Nanoscience and Nanotechnology (JNN),
Vol.15, 10, 8183-8186 (2015) Impact Factor = 1.352
[abstract] |
| 14. Sang-Kon Kim, "Impact of process parameters on pattern formation in
the maskless plasmonic computational lithography," Current Applied Physics (CAP) Vol.15, 6, 698-702 June (2015) Impact Factor = 2.026
[abstract]
|
| 15. Sang-Kon Kim, "Prediction of electric field effects on defect-free
self-assembled nano-patterning of block copolymer," Journal of Nanoscience and Nanotechnology (JNN),
Vol.16, 3, 2706-2709 (2016) Impact Factor = 1.556
[abstract] |
| 16. Sang-Kon Kim, "Impact of process parameters on a combining process
of block-copolymer self-assembly with electrohydrodynamic jet printing," accepted |
| 17. Sang-Kon Kim, "Extreme Ultraviolet Multilayer Defect Compensation in
Computational Lithography," Journal of Nanoscience and Nanotechnology (JNN), Vol.16, 5, 5410-5419 (2016) Impact Factor = 1.556
[abstract] |
| 18. Sang-Kon Kim, "Effect of Computational Lithography Parameters on
the Organic Light-Emitting Diodes," Journal of Nanoscience and Nanotechnology (JNN),
Vol.16, 8, 8496-8499 (2016) Impact Factor = 1.556 |
| 19. Sang-Kon Kim, "Computational Study of Electrohydrodynamic Jet Printing
with Block-Copolymer Inks," accepted |
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